This is a significant move for Tyndall, Ireland’s premier ICT research institute, and marks a new alignment of research interests for both organisations. Tyndall CEO, Professor Roger Whatmore, said the agreement was a vote of confidence in the high quality of research at Tyndall which had earned the institute an international reputation. The three-year agreement, he added, was likely to lead to further joint projects.
Mr Mike Mayberry, Director of Components Research, VP Technology and Manufacturing Group, Intel, said that Tyndall and Intel had developed a close relationship over the past number of years through collaboration on different technologies. The latest agreement was another step in the evolution of the relationship and Intel was excited at the potential of the advanced research programme. The agreement will bring together Tyndall researchers as well as researchers from Intel’s prestigious research group in the US, to investigate next generation materials, devices and photonics technologies for use in future electronic applications.
Welcoming the announcement, the Minister for Enterprise, Trade and Innovation, Mr Batt O’ Keeffe, said Intel had demonstrated its belief that Ireland possessed the research capability to develop cutting-edge technologies for globally competitive markets.
UCC President, Dr Michael Murphy, said UCC and Intel had enjoyed a strong relationship over the past 15 years, since the University’s Chemical and Engineering departments first collaborated with the US corporation. UCC, he added, as a research leader in Ireland, would continue to produce graduates of the highest calibre while working closely with innovation-led industry. The agreement was signed today, September 21st , at a ceremony in Tyndall’s Cork headquarters.(2).jpg "Tyndall and Intel Move Closer")