Patents

Patent Code  Patent Type
US08488640 Integrated optical comb source system and method
US08300994 Transmitter photonic integrated circuit (TxPIC) chip
US07978981 Structure and apparatus for a very short haul, free space, and fiber optic interconnect and data link
US07885492 Transmitter photonic integrated circuit (TxPIC) chips
US07792396 Probe card for testing in-wafer photonic integrated circuits (PICs) and method of use
US07773837 Monolithic transmitter photonic integrated circuit (TXPIC) with a transversely disposed output
US07747114 Tilted combiners/decombiners and photonic integrated circuits (PICs) employing the same
US07680368 Monolithic transmitter photonic integrated circuit (TxPIC) with a traversely disposed output
US07672546 Optical transport network having a plurality of monolithic photonic integrated circuit semiconductor chips
US07555220 Chromatic dispersion compensator (CDC) in a photonic integrated circuit (PIC) chip and method of operation
US07519246 Photonic integrated circuit (PIC) chips
US07512295 Transmitter photonic integrated circuits (TXPICS) with directly modulated lasers and wavelength selective combiners
US07477807 Monolithic transmitter photonic integrated circuit (TxPIC) semiconductor chip
US07444048 Tilted combiners/decombiners and photonic integrated circuit (PIC) employing the same
US07437029  Method of manufacturing and apparatus for a transmitter photonic integrated circuit (TXPIC) chip 

US07340122 
Monolithic transmitter photonic integrated circuit (TxPIC) with integrated optical components in circuit signal channels 
US07295589  Frequency modulated vertical cavity laser 
US07283694 Transmitter photonic integrated circuits (TxPIC) and optical transport networks employing TxPICs
US07236656 Optical transport network
US07158699 Method of optimizing optical channel signal demultiplexing in a monolithic receiver photonic integrated circuit (RxPIC)

US07135382
In-wafer testing of integrated optical components in photonic integrated circuits (PICs)
US07129100 In-wafer testing of integrated optical components in photonic integrated circuits (PICs)
US07123786 Compact, cost-effective optical-electrical-optical (OEO) converter for an optical transmission network
US07116851 Optical signal receiver, an associated photonic integrated circuit (RxPIC), and method improving performance.
US07116694 Transmitter array with pixel element that has primary semiconductor laser and at least one secondary semiconductor laser.

US07092425
VCSEL device with improved modal properties
US07079718 Optical probe and method of testing employing an interrogation beam or optical pickup
US07058263 Optical transport network
US07058246 Transmitter photonic integrated circuit (TxPIC) chip with enhanced power and yield without on-chip amplification
US07050719 Wavelength division multiplexing receiver for wavelength tracking
US07049570 Optical chip coupling system utilizing micromachine adjustable optical elements and a feedback circuit providing the micromachine with a feedback signal correlated to an optical signal parameter
US07043109 Method of in-wafer testing of monolithic photonic integrated circuits (PICs) formed in a semiconductor wafer
US07027703 Method for forming and apparatus comprising optical waveguides leading to a free space coupler region
US07006719 In-wafer testing of integrated optical components in photonic integrated circuits (PICs)
US06999489 Electrical isolation of optical components in photonic integrated circuits (PICs)
US06985648 Method of in-wafer testing of monolithic photonic integrated circuits (PICs) formed in a semiconductor wafer
US06922422 Heat isolation and dissipation structures for optical components in photonic integrated circuits (PICs) and an optical transport network using the same
US06839370 Optoelectronic device using a disabled tunnel junction for current confinement
US06804271 Light emission methods and light emission devices.
US06771682 Electrical isolation of optical components in photonic integrated circuits (PICS)
US06465811 Low capacitance bond pads for high speed devices.
WO 01/04951 A1 Low capacitance bond pads for high speed devices.

US06341138
Constant temperature performance laser
US06341137 Wavelength division multiplexed array of long-wavelength vertical cavity lasers
US06122417 WDM Multiplexer-Demultiplexer using fabry-perot filter array
US05918108 Vertical cavity surface emitting laser with enhanced second harmonic generation and method of making same
US05835517 WDM Multiplexer-Demultiplexer using Fabry-Perot filter array
US05812571 High-power vertical cavity surface emitting laser cluster
US05724375 Vertical cavity surface emitting laser with enhanced second harmonic generation and method of making same

Room 116G, 1st Floor floor, School of Physics, University College Cork, Ireland,

Top