Prof Cian O’ Mathuna, Tyndall National Institute and School of Engineering in UCC, had a patent granted in 2024 in the area of semiconductors. The patent describes an advanced inductor device designed to improve power supply efficiency in microelectronics systems from smartphones to High Performance Computing for AI and data centres. 

Traditional power supplies often rely on bulky magnetic components, which limit their miniaturisation. The patented design reduces the need for large, discrete magnetic components, significantly shrinking the overall size of the power supply and leading to higher system efficiency. This invention enables the integration of the power supply with the load (i.e. the processor chip or AI engine) using a technique called integrated voltage regulator (IVR) technology. IVRs enhance power delivery efficiency by eliminating parasitic losses and providing a faster transient response, making these devices significantly more energy-efficient, leading to longer battery life or reduced data centre energy utilisation and reduced heat generation. 

The miniaturisation of components means that devices can be made even smaller and lighter without sacrificing performance. Additionally, the improved power delivery and faster response times can enhance the overall user experience, making devices more responsive and reliable. This technology also opens up possibilities for more compact and efficient wearable devices, smart home gadgets, and other consumer electronics, driving innovation and improving functionality in the tech we use daily.

The patent is focused on creating a vertical inductor, rather than a flat planar one, which takes up dramatically less footprint underneath the processor chip and allows a large array of power supplies with the patented inductors to deliver granular power to the processor chip. This patent leverages almost 30 years of Tyndall research in integrated magnetics technology, with the outputs being licenced to multiple international companies. Following additional proof of concept research over the coming year, we aim to licence this patent non-exclusively to Tyndall industry partners.

Based on his expertise as an innovative researcher, Cian has been invited to give a plenary talk at APEC2025, the IEEE Applied Power Electronics Conference, on “The Future of Integrated Magnetics in enabling High Performance Computing.”

This case study originally appeared in UCC Innovation's Impact Report for 2024, which can be read here.