Collaborative paper published in Microelectronics Reliability

  • 24 Jan 2013

A collaborative paper between the Ultrasonics Research Group in UCC and researchers in the Tyndall National Institute has been published in the Elsevier journal Microelectronics Reliability.

The full citation is: P. Jesudoss, A. Mathewson, W. M. D. Wright and F. Stam, "Mechanical assessment of an anisotropic conductive adhesive joint of a direct access sensor on a flexible substrate for a swallowable capsule application", Microelectronics Reliability,

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